Industry events give us a real pulse check on where the industry is heading. As the largest trade fair for the embedded community, embedded world brings together over 1,100 exhibitors and 32,000 visitors in Nuremberg each year to explore the latest in embedded hardware, software, tools, and services. From March 10th through 12th, we’ll be in Nuremberg with a few meaningful updates to share and excitement for the discussions that always come out of days on the floor.
The best part? We’re giving away free demo kits containing the low footprint platform implementation of eFlex SDK.
How do you get OT data to move freely, securely, and with enough context to actually be useful?
At embedded world, engineers, and system architects all wrestle with this same question. We are thrilled to share Matrikon’s OPC UA SDK solutions face-to-face with our visitors. There’s something irreplaceable about being together in person, you can convey so much more than any email exchange or product sheet ever could.
What we’re showcasing:
A lot has happened on the product side since last year, and embedded world is the perfect place to introduce our updates to the market.
One path to OPC UA over TSN
We’ve been working on the integration between Matrikon eFlex and the BE.Services eTSN stack, which brings together OPC UA over Time-Sensitive Networking and OPC UA FX Controller-to-Device communications. For device manufacturers, it removes a lot of the assembly work that typically goes into building deterministic communication solutions. Users get a consistent, validated path without having to stitch together separate libraries.
Where to Find Us
We’ll be in hall 4, booth 151, demonstrating OPC UA interoperability and how devices at different scales communicate securely and reliably. Come and see us!
Don’t forget: Visit our booth or click the link below to get a free eFlex Demo kit, pre-loaded with a low-footprint platform implementation of the Matrikon eFlex SDK.
